India designs roadmap to design the world’s most advanced chips

On May 30, NITI Aayog released Future of India’s Semiconductor Industry — a ten-year roadmap targeting a $120–150 billion value chain by 2035. Instead of chasing cutting-edge wafer fabrication, it proposes a “Morethan-Moore” strategy: maturenode manufacturing, advanced packaging, and design innovation as core pillars. India already houses 20% of the world’s semiconductor design workforce. Twelve fab projects and 24 design projects have been approved under the India Semiconductor Mission. India’s first 3nm chip design centres opened in Noida and Bengaluru last year. For thirty years, India has been the world’s back office — building software for IP it didn’t own. The roadmap signals a shift. India is entering the chip value chain through its strength, not its weakness. The country that has long made designs for others is staking a claim to design its own. However, India needs to make the implementation as good as policy. News Source: Press Information Bureau

News Source: Press Information Bureau